Three years ago a team from Bell Labs took on a very daunting challenge – put an optical networking system on a commercially manufactured silicon chip, load it with a smorgasbord of sophisticated opto-electronic devices in a combination that’s never been done before, and make it easy to mass produce. The project is part of a U.S. DARPA-funded program (Defense Advanced Research Project Agency) to develop technologies and design tools necessary to fabricate an application specific, electronic-photonic integrated circuit (EPIC). This program is led by BAE Systems in partnership with MIT, Applied Wave Research, and Bell Labs, through Alcatel-Lucent’s LGS...