and they are cooled... how???
Posted on 09/06/2011 4:12:37 PM PDT by Straight Vermonter
Edited on 09/07/2011 9:10:42 AM PDT by Admin Moderator. [history]
The computer giant and 3M this week are announcing a collaboration to advance the practice of stacking multiple chips on top of each other, packing much greater computing and data-storage capability together into a small space. Electronics companies now routinely stack a few chips together
(Excerpt) Read more at blogs.wsj.com ...
It does sound like there is a real shift in thinking is happening here.
Ping
This has been on the agenda for over 10+ years. The real next revolution is the optical LSI chip.
When I saw that 3M is involved, I immediately wondered if they’re taping them together.
That certainly makes them faster but I don’t see how that is going to allow a device to pack more into a given geometry.
Even longer than that, some early packaging concepts way back in the 50s used stacked thick film modules. Then this guy Kilby came along with this nutty monolithic idea ;-)
It’s sure an intriguing concept, and maybe if they do make it work there’ll be a Nobel price in it. (The kind that actually mean something)
> When I saw that 3M is involved, I immediately wondered if they’re taping them together.
Still, this story is very important, and I’m glad someone did PostIt.
They’ve been watching too many episodes of the Red Green show.
How far along is the quantum state chip? It has been several years since I first read of this.
It’s probably because if you can stack them, the computers would be taller, but take up less floor space. When you’re talking about the space that supercomputers take up, even being able to add one row of computer chips on top of each other could halve the floor space the supercomputer takes up.
and they are cooled... how???
That’s certainly one of the problems.
Could they water cool it?
I didn't have enough room on the wire-wrap board for two RAM chips, so I put one on top of the other and soldered all but the /CS pins together. The top chip's /CS pin was then bent outwards and the /RAMHIGH signal was wire-wrapped to the pin.
Early stacking. :)
It would not suprise me if they have to employ vertical cooling channels within the stacks to draw the thermal energy away at a rate sufficient to keep the stack from malfunctioning. Some form of non-conductive liquid/oil/gel circulating through the stack would almost seem a necessity. If its all sealed into a “brick” the surface area is most likely insufficient to support a purely air cooled approach.
“IBM is going all-in on this hand Mike!”
“Wow, Skip! You just don’t see this kind of play at every WPT tournament!”
“That’s one big stack!”
“You might call that fanstacktic, Skip.”
“We might call you sh_t-for-brains, Mike.”
I just read about the first quantum integrated processing and memory circuit. Basically it should be ready when we recover from the Obama recession.
prolly wi Fluorinert coolant like the Cray's...
fluorinert liquid cooling will add $$$ so i guess they'll be servers and ultra high end machines
Might as well make it a bee hive design with a internal cooler at it’s core.
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