Posted on 12/11/2002 7:48:14 AM PST by GeneD
One of the major technical headaches facing chipmaker Intel is the leaking of current from inactive processors, company chairman Andy Grove told an audience at International Electron Devices Meeting in San Francisco yesterday.
"Current is becoming a major factor and a limiter on how complex we can build chips," said Grove. He said the company engineers "just cant get rid of" power leakage.
The problem of leakage threatens the future validity of Moores Law. As chips become more powerful and draw more power, leakage tends to increase. The industry is used to power leakage rates of up to fifteen per cent, but chips constructed of increasing numbers of transistors can suffer power leakage of up to 40 per cent said Grove. In chips made up of a billion transistors may leak between 60 and 70 Watts of power, he warned. The power is largely dissipated as heat causing cooling problems for powerful chips.
While Intel is seeking ways to design chips with multiple cores with improved design and better insulators, Grove suggested that Moore Law regarding the doubling of transistor densities every couple of years will be redundant by the end of the decade. Chip makers will have to make more efficient use of the transistor in order to deliver ever increasing performance, he suggested.
Grove also addressed the diminished likelihood of an upturn in the chip industry in the near future. "Over the course of the past year (the industry) has been bounding along on the bottom," he said, but he warned that the threat of a "war" on Iraq doesnt bode well for the future employment rate in the US and a may spark a consequent "meltdown" in some South American economies.
The industry "was operating, in retrospect, way ahead of the underlying demand," he said in his keynote speech to the conference. "The excess of the latter 1990s was so much bigger than previous excesses," he confessed.
Grove also later warned that the trend of migrating chip manufacturing to far eastern fabs could shift the balance eastwards. "It is easy to project," he said, "that the interdependence becomes more one-sided, with an adverse impact on our educational system because so much of the university funding comes from industry. There is a spiral there in the wrong direction."
The trend also carried "huge" implications for defence, he warned.
We use fluorinert. It's safer for circuitry than water and easier to handle than cryogenic coolants.
The capitalists will find new opportunities to create and expand markets. It's your type of attitude that keeps us from reaching full employment.
Oh there'll always be a future market for improved microprocessors and chips.
It's just that they've reached that phase in the product life cycle where Intel may want to evaluate other strategies for product differentiation.
They've already gone from a sensible numbering system to glitzy, sexy, but meaningless, names for their chips.
Perhaps adding a choice of bold designer colors is an option. They could even get into some licensing arrangements with Disney to put Mickey's image on their product. That's always a big seller.
Yep, I exert tremendous influence over the market.
I'm a consumer.
The trend also carried "huge" implications for defence, he warned.
Grove is the first CEO I've ever heard mention defence implications or any adverse effects of outsourcing.
Stacking layers will multiply the heat-dissipation problem. One approach might be to start getting away from wiring (with it's parasitic capacitance problems) and interconnect chips via on-chip laser. Then you could arrange a set of chips into a cube (or N-sided polyhedron), and have each of the six sides be able to communicate thru the inside of the cube via light-beam
Lian Li makes an excellent 2-in/3-out aluminum case. Several other companies have taken to copying their design.
And input filters have been around forever but, they tend to be nominal because the better the filter, the less the air flow.
The case below is a Lian Li 65...you can see the rear fan and the intake for the Enermax power supply. There is a blow hole fan just out of sight, next to the power supply. Down at the bottom front you can see part of one of the hard drives lying on it's side. It's one of four that are positioned behind the dual-intakes/filter.
That is just what Boeing started preaching after contracting the McDonnell parasite from the carcass of Douglas. There will always be a market for bigger, better, faster. We have by no measure run out of uses for faster computers.
The current issue of Electronic Engineering Times reports extreme power-consumption problems with quantum chips, with researchers not even close to anything practical.
Nor have we surpassed the need for more energy efficient lightbulbs.
I would think that clean components would allow the air to get to the heat source much more efficiently without the layer of insulating dust.
Esp[ecially since one of the big reasons for putting everything on one chip is that the clock speeds are making the effective distance throught the transistor arrays an obstacle as well - enough so that putting little transmitters to send clock from one side of the chip to the other is being considered.
That was a trademark issue. One cannot trademark numbers.
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