It would actually be kind of a neat project to make a macro scale chip with a 3d printer laying down the different layers with the requisite materials.
Intel 8080 processor from 1974 only had 4,500 transistors.
It can certainly be an educational project (and with current technology it is affordable) to tell students to try to recreate it without examining the original.
They’ll learn some humility at least.
Already tried....electron beam deposition...it’s too slow.
Today’s technique does it a single die at a time...repeated over the surface of the wafer...each die has multiple layers...various insulating, conductive and semiconductors layers....and sub micron geometry...that is less than the wavelength of light.
See Applied Materials Co who invented cluster tools.
And ASM LITHOGRAPHY who make the optical tools.
Ion implant tools are used to change semiconductor characteristics by implanting phosphene atoms...regards.
Wouldn’t work
They already have that. It’s called Molecular Beam Epitaxy.