Did you mention the materials such as arsenic-trioxide, phosphine, boron-tribromide, Phosphrous oxichloride, sulfuric acid, aquaregia, HF, 30% hydrogen,Oxygen, Arsine, Silane, SiCl4, 30% hydrogen peroxide,Photo-resist(negative and positive types), platinum, Titanium-Tungsten sputtering, Epitaxial deposition, etc.?
Worked in production wafer fabrication from 1969 to 2001 Bipolar and MOS processes. Photo, etch, epitaxy, diffusion, metalization and test.
Takes special people from the operators to the top management to actually produce a working microchip.
Have often referred to making IC’s as “Applied Rocket Science”
General Electric, General Instruments, Fairchild, AMD, and Sony after the San Antonio AMD facility was sold to Sony are all on the resume.
Excellent experience.
I was working in R&D at Signetics when AMD started up just down the street from us.