But, personally --- as an engineer with extensive microelectronics packaging and interconnection experience, I know that there's basically no way anyone could "add a chip to a board" (especially one of today's complex multilayer boards) without spending megabuck$$ on redesign. And, even if they did, it still would be glaringly obvious when checked against the original design...
TXnMA
Not if it’s designed in to begin with. Or they get the design and add it to the manufacturing process.
I did MES work for many years.
TXnMA wrote:
“Read the linked article. The world’s biggest company has plenty of inspection and test capability — and they haven’t found even one.
But, personally -— as an engineer with extensive microelectronics packaging and interconnection experience, I know that there’s basically no way anyone could “add a chip to a board” (especially one of today’s complex multilayer boards) without spending megabuck$$ on redesign. And, even if they did, it still would be glaringly obvious when checked against the original design...
FAKE NEWS!!
TXnMA,”
Good point about the necessity of circuit card “re-spins”.
Look at the effect that this “news” is having on the industry and financial markets.
Maybe that was the intent...
But, personally --- as an engineer with extensive microelectronics packaging and interconnection experience, I know that there's basically no way anyone could "add a chip to a board" (especially one of today's complex multilayer boards) without spending megabuck$$ on redesign. And, even if they did, it still would be glaringly obvious when checked against the original design...
Yeah...and if a modified chip was used..that would require access to all the design and manufacturing steps and a separate run and test of the modified chips....apart from the problem of subsequent tracking where the modified chips went to.
We talking sub micron design changes to the semiconductor chip level....
not possible.
