ONE of the problems with EMP, involves the way IC chips are made: microscopically thin gold wires connect the actual silicon chip to the pinouts on the IC packaging. Certain types of EMP run sufficient current through those wires to melt them. The chip itself isn’t hurt, but since it’s not connected to the case anymore, and it’s molded and epoxied shut, you can’t break the chip back open without cracking the silicon slab and TRULY destroying the chip. . .
“Certain types of EMP run sufficient current through those wires to melt them”
Those wires are waaaay toooooo smaaaalllll to pickup that level of voltage to generate enough heat to melt the solder. The induction from EMP wouldn’t cause enough heat to matter. EMP also has an extremely short duration, hence long wire requirements.