Ping
I did some prototype 3D molded printed circuit “boards” back in the late 1980s. The technology involved selectively plating conductors on molded parts, then additively increasing the thickness, and it worked pretty well, allowing things like PC traces “going up the walls” of an enclosure for example, taking advantage of available real estate. Of course printed electronics is a whole ‘nuther thing, but doing the logical combination of 3D printed substrates and then depositing conductors, insulators, passives, and organic semiconductors certainly has potential.
Someone pointed out that it takes more metal to make the chassis and connectors between chassis and modules for Hakkens’ Phonebloks than would be saved by using the modular design he envisions.
Until that is sorted out I don’t think it will be economically feasible.
Wanna argue over here?
Heh, Kidding.
Being able to print a circuit board the same size as a standard ATX motherboard with multiple layers and plate through the holes would be awesome.
It would revolutionize the industry with tons of home-grown systems. I’ve got some designs in my head but I’d like to be able to realize beyond the breadboard but it requires multiple layers and not just top and bottom which are easy except for the plate through holes but other layers in between as well.
Bring it on.