Posted on 04/02/2013 11:22:39 AM PDT by Ernest_at_the_Beach
MILPITAS, Calif., Apr 02, 2013 (BUSINESS WIRE) -- GLOBALFOUNDRIES today announced the accomplishment of a key milestone in its strategy to enable 3D stacking of chips for next-generation mobile and consumer applications. At its Fab 8 campus in Saratoga County, N.Y., the company has demonstrated its first functional 20nm silicon wafers with integrated Through-Silicon Vias (TSVs). Manufactured using GLOBALFOUNDRIES' leading-edge 20nm-LPM process technology, the TSV capabilities will allow customers to stack multiple chips on top of each other, providing another avenue for delivering the demanding performance, power, and bandwidth requirements of today's electronic devices.
(Excerpt) Read more at marketwatch.com ...
Crystalwell is very wide memory for Haswell GT3
Uses 2.5 D stacking.
Texas Instruments Battery Management Chip Cuts Charge Time in Half. ( Mobile Devices IC )
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